We provide groundbreaking
Conductive films for bonding electronics and thermal transfer
Our mission
Our mission is to provide a sustainable, affordable, and efficient solution for bonding components on flexible substrates at low temperatures and low pressure, enabling technological development in the flexible hybrid electronics industry.
Cost effective
By utilizing our alignment technology silver content is reduced by 70% compared to other adhesive solutions, thus making it less expensive.
Sustainable
Less conductive particle content reduces climate impact up to 90% compared to other bonding solutions.
Logistics
Automotive
Display
IoT
Healthcare
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